EDN

ADE debuts 3D metrology tool for copper CMP

SAN FRANCISCO–ADE Corp. introduced what the company claims is the first non-contact, inline 3-D metrology system for copper CMP processes. NanoXam is said to measure copper dishing of wide lines and ...
EDN

Rohm and Haas Unveils New ACuPLANE™ Copper Barrier CMP Solution

HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
Business Wire

Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at High Production Speeds

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...
Semiconductor Engineering

Addressing Thin Film Thickness Metrology Challenges Of 14nm BEOL Layers

This paper describes a method to effectively monitor the film stack at different metal CMP process steps using a spectroscopic ellipsometer metrology tool. By proper modeling of the Cu dispersion and ...
Houston Chronicle

(BW) Air Liquide Electronics Thinks Outside the Fab for Copper Cleaning Applications

Chemical Mechanical Planarization is a semiconductor manufacturing process that uses slurries consisting of abrasive particles and ancillary chemicals to clean and condition semiconductor wafers ...