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Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process further allows ...

SUTD, SUSTech and ZJU researchers' proposed process flow guides 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in jet ...

A calibrated model assures that the model will reflect actual process behavior and can display realistic 3D visualizations of complex process flows.

Researchers have proposed process flow guides for 3D printing of miniature soft pneumatic actuators. Integrating the prints into a robotic system offers potential applications in jet-engine ...