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SK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centers
Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND flash. The super dense NAND chips which will power these UFS 4.1 ICs are ...
Most smartphones and computers today boast extremely fast read and write speeds, thanks to a paradigm shift towards flash memory, especially in consumer PCs. NAND flash memory finds use in a variety ...
NAND flash technology is on a roll with advancements in cell structure and the subsequent boost in storage density. That allows this non-volatile-memory (NVM) chip to deliver faster throughput and ...
TL;DR: Apple's new iPhone Air storage upgrades are blocked due to unique NAND flash chips with serials starting "2NB," likely sourced from non-traditional suppliers ...
The global boom in artificial intelligence has triggered a severe shortage of essential storage chips, doubling prices in just six months, according to Khein-Seng Pua, CEO of Phison Electronics. The ...
TOSHIBA OFFERS A WIDE RANGE OF EMBEDDED AND REMOVABLE MEMORY TO ADDRESS GROWING USE OF NAND FLASH IN MOBILE HANDSETS Multi-chip Packages, Package-on-Package Technology, MCPs with Configurable MLC and ...
TL;DR: SK hynix is developing High Bandwidth Storage (HBS), combining mobile DRAM and NAND in a single package using innovative Vertical Wire Fan-Out (VFO) technology. This multi-layer stacked memory ...
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