Filtronic, the RF and mmWave specialist, has enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder. Suitable for power semiconductors, automotive ...
Wire bonding, a critical yet often overlooked process in electronics manufacturing, plays an indispensable role in shaping the devices we rely on today. A programmable semi-automatic ultrasonic wire ...
QP Technologies can create secure aluminum wedge bonds, like those shown in this microscopic image, for RF, power and mil-aero device packages using its Hesse Mechatronics bonders. ESCONDIDO, Calif., ...
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