Carson Burt, a technical support engineer at Indium Corporation, will deliver a technical presentation on solder paste best ...
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As a technical team deeply engaged in the SMT solder paste processing field, we understand that under the wave of smart manufacturing, process standardization has become the core approach to improving ...
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How to Choose an SMT Chip Processing Factory? Core Parameters and Pitfall Guide for 2025 Revealed!
SPC Statistical Process Control: Real-time monitoring of key parameters such as stencil printing thickness, placement pressure, and reflow soldering temperature should be conducted, and if the defect ...
Abstract: This paper presents a novel approach using artificial neural networks (ANN) to predict intermetallic compound (IMC) height growth in ball grid array (BGA) component solder joints under ...
Abstract: Sn-based solder is a typical material for electronic interconnections. Low-Ag-content Sn-based solder exhibits a low hardness and is promising for avoiding the drop-induced failure. However, ...
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