Abstract: The ball grid array (BGA) is a type of popular and competitive package in electronic flip-chip packaging due to its feasibility in high density integrated circuits and convenience in the ...
ICOMAT’s first RTS factory creates preforms in 5 minutes for parts with -65% weight, higher strength and damage tolerance.
†Centre for Biosystems Science and Engineering, Indian Institute of Science, Bangalore-560012, India ‡ Department of Chemical Engineering, Indian Institute of Science, Bangalore-560012, India § ...
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