The Terecircuits team working on the Terefilm solution. · GlobeNewswire Inc. MOUNTAIN VIEW, Calif., Oct. 08, 2024 (GLOBE NEWSWIRE) -- Terecircuits Corporation, a venture-backed startup in advanced ...
BANGALORE, India, May 16, 2025 /PRNewswire/ -- The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic ...
A research team has developed a novel bond coat material that significantly improves the oxidation resistance of thermal ...
This FAQ addresses the specific challenges this transition presents for assembly and how structural adhesives are emerging as an enabler for these complex systems.
A novel negative-tone, photosensitive, polymeric bonding material is proposed that can be used as a dielectric enabling polymer/metal hybrid bonding. August 18th, 2022 - By: Brewer Science Wafer-level ...
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