Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; ...

A new technical paper titled “Power Consumption Optimization of GPU Server With Offline Reinforcement Learning” was published ...

A technical paper titled “Enhancing Test Efficiency through Automated ATPG-Aware Lightweight Scan Instrumentation” was ...

A new technical paper titled “Josephson Junctions in the Age of Quantum Discovery” was published by researchers at Lawrence ...

Problems and solutions for improving performance with more data. Demand for new and better AI models is creating an ...

How much value does DAC really add to the industry? Large EDA companies may be ignoring some of the benefits.

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

Plan for multiple complementary verification methodologies for different levels of processor integration. With the explosive ...

In the past, simulation was the only tool available for verification, but today there are many. Balancing the costs and ...

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...

As AI applications rapidly advance, AI models are being tasked with processing massive amounts of data containing billions – or even trillions – of parameters. Each large workload involves numerous ...

Pros and cons of replacing copper with optical in data-intensive AI systems.